• The machine is intended for processing small-size work-pieces from ceramics, glass-crystal, semi-conductor materials, natural and artificial stones and other hard materials.

• It provides cutting of work-pieces (including those of arbitrary form), producing of microcuts, micronotches. Polishing and  faceting of work-pieces can be carried out using additional accessories.

• Cutting wheels from diamond-containing foil of thickness from 15 µm up, and standard cutting wheels of thickness from 0.3 mm are used in the machine.

• Rotation speed of the diamond wheel is adjustable in the range from 100 up to 8000 rev/min.

• Several versions of the machine are available, including one with remote control for working in "hot" chambers and other special environments.

• It is intended for processing plates of natural and artificial facing materials: granite,  marble, ceramics etc. of thickness up to 40 mm.
• Design of the machine allows cutting of plates under the angle from 45^o to 90^o, adjustment of the position of the cutter with respect to the table, independent water cooling of the cutter under  open-ended cycle.
• Standard diamond tool - cutting wheels with diameter from 260 to 450 mm are used in the machine.
• Rotation speed of the wheel is 1430 rev/min. The maximum linear velocity - 32.2 m/s.
• Power supply voltage - 380 V. Power consumption - 4.0 kW.
• The weight of the machine is 630 kg. Its dimensions are 3000x1080x1800 mm.

LABWARE*

"MICROREZ 300" (Low Speed Diamond Wheel Saw)

     "MICROREZ 300" is intended for precision plane-parallel cutting small-sized billets of hard and brittle nonmetallic materials (glass, ceramics, quartz, semi-conductor materials etc.) with round or rectangular cross-section in a cross plane by diamond tool. The device can cut a billet with round or rectangular cross-section glued on a glass lining, with cutting step, which is set by the operator.
     Device has the controlled electric drive that rotates the spindle and a cutting diamond disc. Disk is cooled by solutions according to technology of cutting. To reduce surface damage of  a billet the device has small (up only to 100 rpm) rotary speed of diamond disc. Displacement of a billet relatively the diamond disc is provided by the bar, which can move in two mutual - perpendicular directions. The bar has the special balancing mechanism for regulation of cutter load.
      The device provides automatic switching-off of the electric drive when the necessary cutting depth is achieved or in emergencies.

• Rotary speed of diamond disc - from 10 up to 100 rpm;
• Diameter of diamond disc - 80 mm (external), 20 mm (internal);
• Maximal size (diameter, thickness or width) of billet - 8 mm;
• Load of cutting - from 1 up to 3 N;
• Micrometric billet displacement  in spindle axis direction  - 20 mm with step 0.01 mm;
• Micrometric billet displacement  in direction perpendicular spindle axes ± 3 mm with step 0.1 mm;
• Power supply voltage - 220 V.
• Power consumption – 75 W;
• Overall dimensions (length Č width Č height): 345 Č 221 Č 204 mm;
• Weight - 5 kg;

    "MICROBUR-3/60" is intended for high-precision samples machining  before their finishing ionic thinning (ionic etching). Device makes in the center of billets ( 3 mm diameter and 200 microns thickness disks of ceramics, semiconductors, carbons, carbon composites, oxides, borides, silicides, glasses and many others materials) a dimple with 50-60 microns depth by  the special diamond tool. Loading on billet, dimple depth and rotary speed of diamond tool are controlled under device working. Automatic switching-off of the electric drive and spindle lifting above billet is provided when preset dimple depth is achieved.
    Visual control of a billet processing is carried out by means of the optical device (demountable monocular) with internal illumination of a billet. To reduce the risk of billet surface damage during dimple producing a diamond paste with the minimal size abrasive powder is applied . A felt wheel and Al₂O₃ water mixture  is used for final smoothing.

• Overall dimensions of billet: diameter - 3 mm, thickness - 200 microns;
• Overall dimensions of a lining: diameter of 18-20 mm, thickness of 1.5-2.5 mm, material of a lining - glass (sapphire, or other hard and transparent material);
• Special diamond tool: disk in diameter (external) 20 mm, thickness of 2 mm;
• Rotary speed of diamond tool - from 10 up to 60 rpm;
• Rotary speed of platen with billet - from 10 up to 60 rpm;
• Load on billet - from 1 up to 3 N;
• Precision of dimple depth measurements:  ± 5 microns;
• Power supply voltage - 220 V.
• Power consumption – 35 W;
• Overall dimensions (length Č width Č height): 264 Č 240 Č 227 mm;
• Weight - 7 kg;

*Prototypes design was carried out together with Institute for problems of materials science of the National academy of sciences of Ukraine (http://www.ipms.kiev.ua)